TF220-M305-D-885
對環境污染的控制已成為經濟發展中的首要義題，錫鉛焊料是一種高度有毒的金屬合金，它作為組裝輔料被廣泛用于現代電子組裝工業。隨著歐美RoHS指令的實施，電子產品制造商已經趨向于焊料的無鉛化。
The control of environmental pollution has been considered as top priorities in economy development.Tin-lead solder is a highly poisomous metal alloy to used widely in modern modern assemble industry as assemable material .As EU RoHS directive adaptep and the electronic manufactuer has move to ward to lead-free process.
由同方公司研發的TF220系列焊錫膏為客戶提供優良的可焊性與印刷型。TF220系列焊錫膏解決了無鉛焊料在應用中出現的各種問題，如：儲存于 運輸穩定性，潤濕性差以及由高溫焊料導致的錫膏不耐熱性。
TF220 series solder paste was developed by TongFang company,which provide excellent and printbility to meet customer’s needs.The TF220 series solves various prob lems as the implementation of lead-free solder.suceh asstorage stability,delivery stality,poorsolder wettability,and poor solder paste heat resistance caused by the high temperature solder.
產品特性：
該產品是殘留物無色透明，活性適中，BGA空洞率低，手動印刷不費力，主要用于中高端產品，如DVD，機頂盒等
產品規格：Solder Specfications
合金成分Composition of solder alloy
| 組成（質量%）Composition(Mass%) | ||
| SN | AG | CU |
| 余量Balance | 3.0±0.2% | 0.5±0.1% |
焊接合金之物理性質Solder alloy physical properties
| 熔融溫度Melting points(°C) | ||
| 液相線Liquidus | DSC峰值DSC peak | 固相線Solidus |
| 218.0 | 220.0 | 217.0 |
| 密度（g/cm3） Density |
拉伸強度（Mpa） Tensile Strength |
延伸率（%） Elongation |
楊氏模量（Gpa） Young’s Module |
0.2%屈服點（Mpa） 0.2%Yield Point |
維氏硬度（Hv） Vickers Hardness |
| 7.38 | 53.3 | 46 | 41.6 | 39.4 | 17.9 |
錫粉規格Solder powder specification
| 類型Type | 目數Mesh | 粒度分布PSD(um) |
| T4 | -400/+635 | 20-38 |
技術數據：
物理性質Physical properties
| 項目Ctegory | 值/結果Values/Results | 測試方法/說明Methods/Remarks |
| 外觀 Appearance |
外觀灰白色，圓滑膏狀，無明顯分層。Shall not have separarated flux,and shall be in smooth paste state | 目視 Visual inspection |
| 金屬含量% Metal Loading% |
88.50 | JIS –Z- 3197 8.1.2 |
| 粘度 Viscosity Pa.S |
170±30 pa.s | JIS-Z-3284 6@ Malcom PCU-205:10 rpm 3 min 25±1°C＜60% RH |
| 粘著性 Tack |
Initial:75.6 gm Takc retention @ 24 hr: 120.2 gm Tack retention @ 72 hr: 96 gm | JIS- Z- 3284 9 |
| 擴散率% Spread Test% |
＞80% | JIS-Z-3197-8.3.1.1 |
| 錫球實驗 Solder Ball Test |
可接受Acceptable | JIS-Z-3284 11 |
| 坍塌測試 Slump Test |
所有間距無橋接No bridges all spcings | JIS-Z-3284 7,8 |
| 印刷壽命 Stencil Life |
＞8小時Hours | @50%RH,23°C（74°F） |
| 再印刷留置時間 A bandon Time |
30-60分鐘 Minutes | @50%RH,23°C(74°F) |
化學性質Chemical properties
| 活性級別 Activity Level |
ROL0 | IPC J-STD-004 |
| 鹵素含量 ppm Halide content ppm |
＞1500ppm | JIS Z-3197 8.1.4.2.1 |
| 銅鏡腐蝕 Copper Mirror |
No removal of copper film 無銅層剝離 | JIS Z-3197 8.4.2 |
| 銅板腐蝕 Copper Corrosion | 沒有腐蝕發生，NO Corrosion Occur | IPC-TM-650 2.6.15 |
電氣性能
| 表面絕緣阻抗 SIR |
Ordinary state 1×1012(Ω)or above After humidifying 1×109(Ω)or above After 100hrs.in humidity | JIS Z 3284-14 |
| 電遷移 Electromigration |
Pass,Tess Conditions:65°C，88.5% RH for 596 hrs | IPC-TM-650,2.6.14.1 |
